We make the world’s best performing reflow ovens and continuous belt furnaces for precision high-volume manufacturing
BTU is the global leader for advanced thermal processing equipment solutions in the electronics manufacturing market
We manufacture and sell advanced thermal processing systems used in solder reflow for SMT and advanced semiconductor packaging — including leading AI chips. BTU International is a premier brand, recognized by our customers for quality and reliability.
High-Performance Convection Reflow Ovens
BTU’s high-performance convection reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes.
Precision-Controlled, High-Temperature Belt Furnaces
BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications.
Our reflow ovens are the market leader for 2.5D advanced packaging applications used in the production of AI chips
Need help? We are standing by 24/7.
BTU’s reflow ovens and custom belt furnaces are known world-wide for their long usable life. This is due, in no small part, to the excellence of our service and support teams. With decades of combined experience these teams can tackle any equipment or process issue facing manufacturers today.
There are many ways we can help – from fast-response emergency service to proactive Health Check visits and service plans.
BTU delivers proven thermal performance across the world’s most demanding electronics and packaging applications—from heavy boards to ultra-thin substrates and beyond.
World Leader in Reflow Ovens for Advanced Packaging
Flip Chip • 2.5D • CoWoS • Panel Packaging • Co-packaged Optics
As AI and high-performance computing push the limits of semiconductor design, BTU’s Aurora and Pyramax reflow ovens meet the challenge with unmatched thermal precision and process control. Designed for advanced packaging formats—including flip-chip, 2.5D/3D ICs, and wafer-level packaging—our systems deliver ultra-low oxygen levels (single-digit ppm), exceptional thermal uniformity, slow programmable cooling, and optional TrueFlat™ warpage control for ultra-thin substrates.
With configurable architecture and seamless MES integration, BTU reflow platforms are production-proven in the most demanding environments—supporting higher yields, tighter tolerances, and next-gen device reliability.
Global Leader in Advanced Reflow for Heavy Boards
BTU’s Aurora and Pyramax reflow oven platforms are engineered to tackle the toughest reflow challenges—now including high-density AI server boards and next-gen data center hardware. Our heavy board configurations are purpose-built to handle massive, multilayered PCBs—often featuring copper or aluminum cores and as many as 16 layers—used in AI acceleration, high-performance computing, aerospace, communications infrastructure, and industrial control systems.
The Aurora 200N delivers unmatched productivity with 200 inches (5080 mm or 5.08 m) of heated length, ensuring even the thickest, most densely populated boards are processed with precision. Featuring closed-loop convection in both heating and cooling zones, it guarantees exceptional thermal uniformity and tight exit temperature control.
Eliminate Warpage — World leader in thin substrate reflow with superior throughput and reliability
Thermal processing is a necessary step to form interconnects in semiconductor packaging, however it can cause warpage in very thin substrates.
Our Pyramax convection reflow oven with TrueFlat technology is purpose-built for advanced packaging lines handling ultra-thin substrates where planarity is critical to yield. It eliminates substrate warpage, even for very thin substrates by applying uniform suction throughout the heating process.
Direct Copper Bonding
BTU is the global market leader in high-precision controlled atmosphere furnaces for Direct Bond Copper (DBC) production.
With our High-temperature solutions for Direct Copper Bonding, we’ve perfected the balance of atmosphere control and thermal uniformity for optimal bonding of two dissimilar electronic materials, resulting in superior product quality.
Learn more about how our experts master the balance of atmosphere control and thermal uniformity to achieve optimal bonding with our TCA Furnace.
Reflow in a New Light
Aurora, the newest reflow oven platform, is designed based on years of expertise and leadership from BTU, the makers of the industry’s best performing reflow ovens. As the latest in a long line of world-class thermal systems, Aurora has quality and innovation in its DNA.
- Modern conveyor options
- Fully updated user interface
- Integrated AquaScrub flux management technology
- Innovative Smart Power energy savings software
- Advanced process control technologies
- Exclusive closed-loop convection control technology
- Flexible zone configuration for optimal heating or cooling requirements
With over 70 years of thermal processing expertise, BTU is a trusted global partner in precision reflow and advanced packaging
From pioneering innovations in SMT to leading-edge solutions for semiconductor manufacturing, our legacy is built on performance, reliability, and relentless innovation. As a proud member of the Amtech family, we continue to set the standard for what’s next in thermal processing.
